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Hotsale single-component fast-curing epoxy bottom filling adhesive for post-assembly filling and protection of BGA/CSP

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Key attributes

Industry-specific attributes

CAS No.
7085-85-0

Other attributes

Place of Origin
Fujian, China
Main Raw Material
Epoxy
Usage
Electronics
Other Names
bottom filling adhesive
MF
mixed
EINECS No.
230-391-5
Classification
Other Adhesives
Brand Name
APS
Model Number
HP23125B
Colors
Black
Density
1.09
Vicosity
3500
Working Time
7 days
Storage Life
6 months

Packaging and delivery

Packaging Details
1.Packaging of thermal pad/ conductive pad / thermal interface pad
Carton boxes size:270mm(L)*170mm(W)*40mm(H)
Packaging Detalis:
The normal package is carton box, if export quantities are too much, we will put the carton boxes on the planker, and then pack the whole planker up to transport.
Port:Xiamen
Selling Units:
Single item
Single package size:
9.8X11.7X0.2 cm
Single gross weight:
0.020 kg

Supply Ability

Supply Ability
250000 Piece/Pieces per Month

Lead time

Quantity (pieces)1 - 500 > 500
Lead time (days)5To be negotiated
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 1 piece
Sample price:
$20.00/piece

Customization

Customized logo
Min. order: 500
Customized packaging
Min. order: 500
Graphic customization
Min. order: 500

Product descriptions from the supplier

Minimum order quantity: 80 pieces
$18.30 - $19.50

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 1 piece
Sample price:
$20.00/piece

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