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      Multi-use High Quality hallogen-free Epoxy underfill for post-assembly filling and protection of BGA/CSP/uBGA

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      Xiamen Aibeisen Electronics Ltd1 yrCN
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      Key attributes

      Industry-specific attributes

      CAS No.
      mixture

      Other attributes

      Place of Origin
      Fujian, China
      Main Raw Material
      Epoxy
      Usage
      Packing, electronic underfill
      Classification
      Other Adhesives
      Brand Name
      APS
      Model Number
      HP23124

      Packaging and delivery

      Packaging Details
      10mL, 30mL, 55mL tube
      Selling Units:
      Single item
      Single package size:
      5X3X20 cm
      Single gross weight:
      0.070 kg

      Supply Ability

      Supply Ability
      100 Piece/Pieces per Day
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      Lead time

      Quantity (pieces)1 - 500 > 500
      Lead time (days)180To be negotiated

      Product descriptions from the supplier

      5 - 499 pieces
      $20.00
      >= 500 pieces
      $8.00

      Quantity

      Shipping

      Shipping solutions for the selected quantity are currently unavailable
      Item subtotal (0 variations 0 items)
      $0.00
      Shipping total
      $0.00
      Subtotal
      $0.00

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